HHV Auto500GB deposition system for glove box integration
The Auto500GB is designed for integration into glove boxes which are used where oxygen or water vapour-intolerant electronic materials are to be coated. The system is fitted with a special chamber to allow straightforward integration into glove boxes from most major manufacturers. The chamber is fitted with a vertically-opening front door which allows access from the glove box, while a hinged rear door allows access for service without compromising the glove box atmosphere.
Source options include resistance, sputter and electron beam plus a range of temperature-controlled effusion sources for the deposition of organic materials.
500mm tall x 500mm wide stainless steel box chambers with options for water cooling Upward sliding front chamber door minimises intrusion into glove box space Hinged rear door provides service access without disturbing glove box atmosphere Single or multiple resistance sources, four position turret resistance source options Straightforward integration template for ease of installation Temperature-controlled effusion sources and controllers for organic materials 3kW multi-pocket electron beam source DC and RF sputtering options Static and rotary work holders Source shutters and substrate shutters Glow discharge cleaning options Film thickness monitoring and control
Deposition of materials which are intolerant of atmospheric oxygen or water vapour Research into organic electronic devices, OLED displays and OFETs Organic solar device research Thin film battery research
Spares and Consumables
Consumable items and original spare parts for your deposition systemAt HHV Ltd, we offer a range of process consumables, spare parts and accessories for your coating system.Our range of process consumables has been specially selected for use with the..
Rear of Auto500GB chamber showing service access door
2 cc effusion source and resistance sources with shields
Glove box chamber with electron beam, sputter and resistance sources
Spares and Consumables
Substrate Rotation, Heating, Cooling, RF and DC Biasing 
Film Thickness Monitoring and Process Control