CT150 PECVD Tool
Cluster PECVD tool for R&D
CT150 is a cluster tool for the deposition of silicon layer for thin film & Hetro-junction Intrinsic Thin layer (HIT) solar cells, metals, metal oxides, metal nitrides, dielectrics, and other materials for nanotechnology applications.
CT150 has four process chambers for different PECVD & PVD processes. Substrate handling is provided by magnetically-coupled transfer arms with options for automation.
Deposition of amorphous and microcrystalline silicon based doped, un-doped, and its alloy materials Individual process chamber connected to central transfer / isolation chamber along with entry / exit load lock connected to transfer chamber. Substrate transfer : magnetic arm or robot Substrate size up to 300 mm x 300 mm Horizontal deposition Semi / fully automatic Power source : VHF / RF Substrate temperature up to 250 deg C