ATS500 is a highly versatile coating system, designed for advanced research and production. It features touch-panel control and a wide range of process techniques, including ion beam. ATS is applied to electronics, optics and ion-assisted processes.
The ATS500 system is designed for research and small batch coating applications. Applications include OLED and organic electronics, photovoltaics and semiconductors.ATS500 systems can be configured for coating lenses and filters in optical applications.
Touch-screen PLC or PC with recipe process control:
Systems are also offered with a PC control system which provides enhanced control and process data recording functions.
Users can select conventional thermal resistance sources, temperature-controlled OLED sources, or a range of electron beam source options plus DC and RF sputtering.
ATS500 chamber accommodates more than one process for maximum flexibility.
Ion assisted deposition:
ATS500 systems can be specified with a compact ion source for substrate cleaning or ion beam assisted deposition processes.
Film thickness monitoring and control:
The standard touch screen is available with an optional built-in film thickness monitor, while conventional thickness monitor and control options are available for the advanced user.
Mass flow and chamber pressure control:
ATS systems feature mass flow control for single, dual or multi-gas channels plus chamber pressure control systems.
Range of sample stages:
Includes rotation, heating and cooling, while further options for indexing, substrate bias, and z-axis lift for sample transfer.
Sample transfer:Available on the ATS 500 with HHV’s telescopic sample transfer system.
Standard chamber is 500mm x 500mm and height and width options are available for specialist applications such as lift-off. The generous size allows multiple sources or deposition techniques to be accommodated.
High vacuum pumping:
Vacuum system options include turbo pumps from 400l/s to 1000l/s and a 1500l/s cryo pump is also available. Foreline pumps can be rotary or scroll.
High vacuum valve:
ATS turbo systems can be supplied with or without a high vacuum gate valve between chamber and high vacuum pump as process and preferences allow.
|Chamber:||500mm wide x 500mm tall. Tall options for lift-off. Stainless steel with aluminium door|
|Turbo Pump:||400 l/s or 1000 l/s conventional turbo. Mag-lev options|
|Cryo pump:||1500 l/s cryo pump|
|Backing/roughing:||Rotary pump or dry scroll pump|
|Vacuum:||Atm to 1x10-6 mbar in <40 minutes, ultimate <5x10-7 mbar, (with 400 l/s turbo pump and clean, dry, empty 500 mm chamber)|
|Weight:||Approx. 450kg to 500kg, specification dependant|
|Resistance sources:||Single or multiple, 1kVA or 2kVA|
|Organic sources:||Temperature-controlled 1cc, 4cc, 10cc, single or multiple sources|
|Electron beam sources:||3kW (4 x 4cc) or 6kW or 12kW (4 x 7cc, 6 x 7cc, 4 x 15cc, 6 x 15cc, other)|
|Sputter sources:||50mm (2”) to 150mm (6”), fixed height, variable height, tilt|
|Sputter configuration:||Upward or downward|
|Ion sources:||Compact ion source options for etch or assisted deposition|
|Mass flow control:||Single gas, dual gas, multiple gas. Chamber pressure control systems|
|Substrate holders:||Rotary, water cooled, heated (quartz lamp or resistance heated), RF or DC bias, z-axis lift for sample transfer, domed calotte, planetary|
|Load lock systems:||Turbo pumped with manual or motor driven transfer arms|
|Combination systems:||Single or multiple techniques in same chamber|